Product Profile of Compact Designed Reflow Soldering System
Compact Designed Reflow Soldering System is ideal for lead free soldering for SMT and semiconductor packaging. The System maintains strong heating zone definition for stable, robust profile development and process control. The System ensures more efficient processing and integrated gas management. Compact Designed Reflow Soldering System is completely energy efficient and low in maintenance.
Key Features of Compact Designed Reflow Soldering System
- Minimal delta t
- High throughput
- Short footprint
- Powerful cooling
- Less nitrogen usage
- Low maintenance
- Energy efficient
- Full accessibility
- More efficient processing
- Integrated gas management
