Sensor and MEMS Packages

Supplier : Interplex India Pvt Ltd

Key Features of Sensor and MEMS Packages
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
  • In Motion sensors
  • In Photovoltaic sensors
  • In Automotive sensors
  • In MEMS Devices
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Product Profile of Sensor and MEMS Packages
Inteplex India manufactures of Sensor and MEMS Packages. Interplex India is an ISO 9001:2000 Accredited Company. The Company manufactures parts for applications including automotive instrument panels, handsets, electronic connectors and switches.

Key Features of Sensor and MEMS Packages
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
  • Copper or Plastic Die paddle
  • Low Dielectric Constant
  • Reel to Reel Dual Lead frame Array
  • High Performance LCP Thermoplastic
  • Several Wire & Die Bondable Plating Options
  • SMD or Through-Hole Packages
  • In Motion sensors
  • In Photovoltaic sensors
  • In Automotive sensors
  • In MEMS Devices