Product Profile of Wafer Cutting Machine, Automatic
R & D Engineers claims to be the first Indian manufacturer of baking machines for wafer biscuits, ice cream cones and rolled sugar cones. The company provides a series of automatic wafer cutting machines. These automatic WC machines are suitable for handling 230 x 290 mm different sizes of wafer sheets. These automatic machines are also useful for cutting flat and hollow wafers filled with cream. The operation of the wafer cutting machine includes cutting operation where, the wafer book are first pushed through one set of cutters and then at perpendicular right angle through a second set of cutters. Some of the salient features of the automatic wafer-cutting machine include using Fixed and tensioned cutting wires in removable frames; Changeover to other cutting sizes is facilitated by quick and easy changing of cutting frames and pushers; designed for high-capacity plants; and occupy less space. The company has in its clientele list major market leaders from food, bakery, chocolates, and confectionery to hotel and restaurant industry.
