Finesse 2,pcb Assembly & Testing Division

Product Profile of Finesse 2,pcb Assembly & Testing Division
PCI LIMITED`s PCB Assembly & Testing Division offers Finesse 2, protection of investment intelligent feeder technology`smart nozzles` true `on the fly` vision.

Breaking all the rules in conventional thinking, the Finesse combines high-speed SMT placement and extensive fine pitch capabilities. It doesn`t stop there either. The system packs a vast 198 x 8mm feeder capacity into a remarkably compact footprint, and utilises truly intelligent feeder technology for the ultimate in flexibility and productivity.

Specifications
-Placement heads 1 rotary head on X/Y gantry with 8 pick ups & a 48 position ?smart? nozzle bank
-Placement rate 13 500 cph [IPC: 11 650 cph]
-Component Range 0201 to 50x50mm [70 x70mm and 100mm connectors in option]
-Minimum Pitch 0.4mm [0.3mm in option]
-Accuracy [3 sigma] +/- 45?m [QFP] to +/- 75?m [Chip]
-Feeder Capacity 198 * 8mm
-PCB Size Range 60 x 60mm to 500 x 460mm